MCCB Mental Stamping Moulding Mccb Connetion Plate

(1) High processing efficiency
Due to the development of NS class high peak current pulse power supply technology and detection, control and anti-interference technology, the processing efficiency of low-speed WEDM is also improving.

(2) Processing efficiency of workpieces with large thickness
When cutting 300 mm thick workpiece, the processing efficiency can reach 170 mm2/min, which is a very significant technical improvement.

(3) Processing efficiency of workpiece with thickness change
It can automatically detect the thickness of the workpiece and automatically adjust the processing parameters to prevent wire breakage, and achieve high processing efficiency in this state.